| |
|
|
|
Bonding: |

|
 |
Single and two component epoxy and silicone, electrically
conductive adhesives. Silver loaded for low resistivity.
Various cure options available including fast snap
cure adhesives.
|
| |
|
|

|
|
Specific die attach adhesives
with high ionic purity, high strength and good heat
resistance. Void free die attachment by automatic
dispenser, stamping or silk screening.
|
| |
|
|

|
|
Economical
graphite/carbon loaded alternatives are available
for general purpose conductive bonding including
dual electrically and thermally conductive adhesives.
|
Thermal Conductives: |

|
|
Specific thermally conductive one and two component
epoxy adhesives and silicon compounds are available
for more critical heat transfer applications.
|
Paints & Shielding: |

|
|
Single component silver, nickel and graphite electrically
conductive coatings. |
| |
|
|
|
|
Suitable for all application
types including E.M.I and R.F.I shielding, circuit
repair, strain and crack detection tracks. Various
solvent carriers including aqueous. Cured properties
include rigid, semi rigid and flexible substrates. |